Contents

• Contents
• List of Tables
• List of Figures
• 1 Introduction
  • 1.1 Purpose
  • 1.2 Scope
  • 1.3 Use of This Document
  • 1.4 Version History
  • 1.5 Instrument Overview
    • 1.5.1 Performance Synopsis
    • 1.5.2 Scientific Objectives
  • 1.6 Instrument Heritage
• 2 Instrument
  • 2.1 Overall Description
  • 2.2 Systems Level Analysis
    • 2.2.1 Optical
      • 2.2.1.1 CCD Chip Array Layouts
    • 2.2.2 Mechanical
      • 2.2.2.1 ACIS Structural Design
      • 2.2.2.2 Structural and Dynamic Testing
    • 2.2.3 Thermal
      • 2.2.3.1 ACIS Thermal Design
      • 2.2.3.2 ACIS Thermal Configurations and Modeling
      • 2.2.3.3 ACIS Thermal Testing
    • 2.2.4 Power
  • 2.3 Instrument Subsystems
    • 2.3.1 CCD Chips
      • 2.3.1.1 Description of Physical Principles
      • 2.3.1.2 Waveform generation
      • 2.3.1.3 Output Amplifiers
      • 2.3.1.4 Radiation damage
      • 2.3.1.5 Flickering Pixels
      • 2.3.1.6 Other instrumental CCD effects
    • 2.3.2 Focal Plane Assembly
      • 2.3.2.1 I Array
      • 2.3.2.2 I Array Imaging Performance
      • 2.3.2.3 S Array
      • 2.3.2.4 S Array Imaging Performance
      • 2.3.2.5 ACIS Flight Chip Locations
    • 2.3.3 UV/Optical Filter
    • 2.3.4 Door
    • 2.3.5 Calibration Sources
    • 2.3.6 DEA Hardware
      • 2.3.6.1 Introduction
      • 2.3.6.2 Interfaces
      • 2.3.6.3 DEA Sections
    • 2.3.7 DPA Hardware
      • 2.3.7.1 Introduction
      • 2.3.7.2 DPA Electronics Design
      • 2.3.7.3 DPA Hardware Recovery Modes
    • 2.3.8 Flight Software
    • 2.3.9 Other
• 3 Operations
  • 3.1 Modes
    • 3.1.1 Imaging Point Selection
    • 3.1.2 Continuous or Timed Exposure
    • 3.1.3 On-board Data Processing Choices
      • 3.1.3.1 Event Recognition
      • 3.1.3.2 Telemetry Saturation Limits
      • 3.1.3.3 Chip Telemetry Choices
      • 3.1.3.4 Alternating Exposure Times
      • 3.1.3.5 Sub-Array Readout and Staggered Readout
      • 3.1.3.6 `Smear' Exposure Times
      • 3.1.3.7 Diagnostic
      • 3.1.3.8 Bias Telemetry Choices
    • 3.1.4 List of Routine Modes
    • 3.1.5 Bias Determination
      • 3.1.5.1 Bias Computation Algorithms
  • 3.2 Commanding
    • 3.2.1 Philosophy
    • 3.2.2 List of commands
    • 3.2.3 Command Sequences
    • 3.2.4 Operational Constraints
    • 3.2.5 SI Monitoring
    • 3.2.6 Contingencies
    • 3.2.7 Operation Scenarios
  • 3.3 On-board data processing
    • 3.3.1 Overview
    • 3.3.2 Timed Exposure Mode Data Processing
    • 3.3.3 Continuous Clocking Mode Data Processing
    • 3.3.4 Telemetry Formats
• 4 Calibration/Maintenance
  • 4.1 Lab Data
    • 4.1.1 CCD Subassembly Calibration Measurements
      • 4.1.1.1 CCD Subassembly Calibration Requirements
    • 4.1.2 Spectral Resolution Measurements (nominal conditions)
      • 4.1.2.1 Objectives of spectral resolution measurements
      • 4.1.2.2 Assumptions for spectral resolution measurements
    • 4.1.3 Quantum Efficiency Measurements (nominal conditions)
      • 4.1.3.1 Objective
      • 4.1.3.2 Assumptions for quantum efficiency measurements
    • 4.1.4 Measurements at ``Off-nominal'' Conditions
      • 4.1.4.1 Objectives
      • 4.1.4.2 CCD Temperature Variations
      • 4.1.4.3 Clock-level Variations
      • 4.1.4.4 Readout Mode Variations
      • 4.1.4.5 Off-nominal Measurements
    • 4.1.5 Facilities and Scheduling Considerations
      • 4.1.5.1 Facilities
    • 4.1.6 Sub-assembly Calibration Data Management
  • 4.2 Optical Blocking Filter Data
  • 4.3 XRCF Data
  • 4.4 ACIS XRCF Measurement List
    • 4.4.1 Introduction
    • 4.4.2 Shutter Focus
    • 4.4.3 Plate Focus
    • 4.4.4 Point Response Function
    • 4.4.5 Effective Area
    • 4.4.6 Count-Rate Linearity
    • 4.4.7 Spatial Linearity
    • 4.4.8 Flight Contamination Monitor
    • 4.4.9 XRCF Calibration Data Management
  • 4.5 Instrument Performance Models
    • 4.5.1 CCD Interaction Simulation
    • 4.5.2 Frontside vs. Backside CCD Performance
    • 4.5.3 Sub-Pixel Position Reconstruction
    • 4.5.4 Radiation Damage Modeling
  • 4.6 Flight Calibration/Maintenance
    • 4.6.1 Orbital Verification Activities
      • 4.6.1.1 OV Phase Constraints
    • 4.6.2 Science Instrument OV Phase Activities
      • 4.6.2.1 ACIS Period 1 Activities
      • 4.6.2.2 ACIS Period 2 Activities
      • 4.6.2.3 Grating Activities
    • 4.6.3 Orbital Bakeout Procedures
• 5 Ground Processing
  • 5.1 Ground Telemetry Processing
    • 5.1.1 Introduction
    • 5.1.2 Telemetry Format
    • 5.1.3 Level 0 Data Products
    • 5.1.4 Other Data Products
  • 5.2 Data Reduction Tools
    • 5.2.1 ACIS-supplied Tools
      • 5.2.1.1 Event Browser
      • 5.2.1.2 Analyst's Guide
    • 5.2.2 ASC-supplied Tools
    • 5.2.3 Web Analysis Resources
  • 5.3 Science Data
• 6 Test Procedures and Quality Assurance
• 7 Traceability Matrix
• 8 Glossary of Acronyms
• A ACIS Grades