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2.1 Overall Description
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1.6 Instrument Heritage
2 Instrument
2.1 Overall Description
2.2 Systems Level Analysis
2.2.1 Optical
2.2.1.1 CCD Chip Array Layouts
2.2.2 Mechanical
2.2.2.1 ACIS Structural Design
2.2.2.2 Structural and Dynamic Testing
2.2.3 Thermal
2.2.3.1 ACIS Thermal Design
2.2.3.2 ACIS Thermal Configurations and Modeling
2.2.3.3 ACIS Thermal Testing
2.2.4 Power
2.3 Instrument Subsystems
2.3.1 CCD Chips
2.3.1.1 Description of Physical Principles
2.3.1.2 Waveform generation
2.3.1.3 Output Amplifiers
2.3.1.4 Radiation damage
2.3.1.5 Flickering Pixels
2.3.1.6 Other instrumental CCD effects
2.3.2 Focal Plane Assembly
2.3.2.1 I Array
2.3.2.2 I Array Imaging Performance
2.3.2.3 S Array
2.3.2.4 S Array Imaging Performance
2.3.2.5 ACIS Flight Chip Locations
2.3.3 UV/Optical Filter
2.3.4 Door
2.3.5 Calibration Sources
2.3.6 DEA Hardware
2.3.6.1 Introduction
2.3.6.2 Interfaces
2.3.6.3 DEA Sections
2.3.7 DPA Hardware
2.3.7.1 Introduction
2.3.7.2 DPA Electronics Design
2.3.7.3 DPA Hardware Recovery Modes
2.3.8 Flight Software
2.3.9 Other
John Nousek
11/21/1997
