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2.2.1 Optical
Up:
2 Instrument
Previous:
2.1 Overall Description
2.2 Systems Level Analysis
2.2.1 Optical
2.2.1.1 CCD Chip Array Layouts
2.2.2 Mechanical
2.2.2.1 ACIS Structural Design
2.2.2.2 Structural and Dynamic Testing
2.2.3 Thermal
2.2.3.1 ACIS Thermal Design
2.2.3.2 ACIS Thermal Configurations and Modeling
2.2.3.3 ACIS Thermal Testing
2.2.4 Power
John Nousek
11/21/1997
