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2.3.1 CCD Chips
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2 Instrument
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2.2.4 Power
2.3 Instrument Subsystems
2.3.1 CCD Chips
2.3.1.1 Description of Physical Principles
2.3.1.2 Waveform generation
2.3.1.3 Output Amplifiers
2.3.1.4 Radiation damage
2.3.1.5 Flickering Pixels
2.3.1.6 Other instrumental CCD effects
2.3.2 Focal Plane Assembly
2.3.2.1 I Array
2.3.2.2 I Array Imaging Performance
2.3.2.3 S Array
2.3.2.4 S Array Imaging Performance
2.3.2.5 ACIS Flight Chip Locations
2.3.3 UV/Optical Filter
2.3.4 Door
2.3.5 Calibration Sources
2.3.6 DEA Hardware
2.3.6.1 Introduction
2.3.6.2 Interfaces
2.3.6.3 DEA Sections
2.3.7 DPA Hardware
2.3.7.1 Introduction
2.3.7.2 DPA Electronics Design
2.3.7.3 DPA Hardware Recovery Modes
2.3.8 Flight Software
2.3.9 Other
John Nousek
11/21/1997
